JPH0373456U - - Google Patents
Info
- Publication number
- JPH0373456U JPH0373456U JP13495989U JP13495989U JPH0373456U JP H0373456 U JPH0373456 U JP H0373456U JP 13495989 U JP13495989 U JP 13495989U JP 13495989 U JP13495989 U JP 13495989U JP H0373456 U JPH0373456 U JP H0373456U
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- semiconductor chip
- sealing resin
- circuit board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13495989U JPH0373456U (en]) | 1989-11-20 | 1989-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13495989U JPH0373456U (en]) | 1989-11-20 | 1989-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0373456U true JPH0373456U (en]) | 1991-07-24 |
Family
ID=31682254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13495989U Pending JPH0373456U (en]) | 1989-11-20 | 1989-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0373456U (en]) |
-
1989
- 1989-11-20 JP JP13495989U patent/JPH0373456U/ja active Pending
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